This website uses cookies to improve your experience on this site. Some of the cookies we use are essential for parts of the site to operate. To find out more about the cookies we use and how to delete them, see our Legal Notice.

I accept cookies from this site

FEICA is proud to announce the 2018 European Adhesive and Sealant Conference & EXPO, set in the Radisson Blue Latvija, Riga, Latvia, from 12-14 September 2018.


Each year, FEICA attracts record numbers of industry leaders to its annual Conference to discuss market drivers and trends, innovation, sustainability and technological advancements.

This year’s Conference will focus on the impact on our industry of the rapid and far-reaching changes resulting from the emerging "digital age”. You can register here.


Business Forum "Adhesives and Sealants in the digital age”

The theme of this year’s business forum is "Adhesives and sealants in the digital age”. Once again, we will have highly regarded keynote speakers, followed by a panel discussion in which you will get the chance to ask questions.

The digital age will be characterised by ever tighter integration between our personal lives, public services and industry, facilitated by the internet and other digital technologies. This coming tidal wave will affect the way business and even society operates. In this context, industry is already at the dawn of "Industry 4.0”, which brings together automation and previously unseen levels of data exchange in manufacturing. This is achieved using cyber-physical systems, the internet of things (IoT), cloud computing and cognitive computing based on artificial intelligence. This offers potential benefits, but also brings with it significant challenges. Data privacy and protection will become even more important and industry has to prepare. The FEICA 2018 Business Forum will explore the implications of the digital age for business and strive to identify practical strategies that will help adhesive and sealant companies to succeed in this new era.

More on FEICA 2018 is available on the conference website.